Description
TIM-PC 8556 is a high temperature rated two parts thermally conductive low viscosity thixotropic compound
which cures at room temperature or can be accelerated with heat. Specially designed to achieve low hardness
and primer-less adhesion to substrates includes metals, plastics and ceramics. Excellent dielectric encapsulation
and vibration absorption.
Applications: Potting and encapsulating of Equipment modules, Power supplies, relays and amplifiers,
Transformers, coils and ferrite cores. Fiber optic wave guide coatings. Encapsulation of circuit boards