Description
TIM-PC 8006M-4 is a low viscosity, easily pourable, filled epoxy resin system featuring high thermal conductivity,
good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components
and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations.
Applications: Typical Applications includes potting or encapsulating densely packaged power supplies,
integrated circuits, small transformers, capacitors bushings etc.