Description
TIM-PC 8018 is a Non-Corrosive and Non-Hazmat, pourable filled epoxy resin system featuring high thermal
conductivity, good electrical insulation, and low shrinkage during cure. It offers the excellent heat transfer, high
voltage insulation and dimensional stability over a wide temperature range. As an encapsulant for power devices
it distributes heat evenly throughout the casting, providing greater efficiency and longer working life.
Applications: Flip chip under fill & glob top encapsulant. Heat sinking; thermally conductive potting for PCB,
SMDs, and thermistors into cavities; potting and protection of resistor coils. Potting power modules found in
electronics such as cockpit, aerospace and RF/Microwave devices.