Description
This is a two part, thermally conductive, thixotropic material, which cures at room temperature or can be accelerated with heat. It is specifically formulated to give low hardness and resistance to slump and features low and high temperature mechanical and chemical stability. It remains flexible and has a natural low level tack, ideal for applications where a strong mechanical or chemical bond is not required. It has a controlled volatile content and an easy mix ratio by volume or weight
