Description
TIM-811HP is a highly chemicals resistance, fast cure, thermally conductive, one part thixotropic epoxy
adhesive. With a relatively low heat cure, it develops excellent bond strength to most substrates including metals,
wood, engineering thermoplastics, composite matrix and ceramics. It offers high heat transfer, low shrinkage and
low coefficient of thermal expansion. High Temperature Rated up to 230°C
Applications: This adhesive is principally used in aerospace and high temperature applications. Excellent
performance where solvent, water and chemicals or chemical vapors resistance required.