Description
TIM-813HTC is a highly thermally conductive, one part thixotropic epoxy adhesive. With a relatively low heat
cure, it develops excellent bond strength to most substrates including metals, wood, engineering thermoplastics,
composite matrix and ceramics. It offers high heat transfer, low shrinkage and low coefficient of thermal
expansion.
Applications: This adhesive is principally used to form thermally conductive joints in fabricated heat sinks and
power devices. Fabricating cold plates and heat sinks. Bonding semiconductors and transistors to heat sinks.