Description
TIM-813LV is a low viscosity thermally conductive, one part thixotropic epoxy adhesive. With a relatively low heat cure, it develops excellent bond strength to most substrates including metals, wood, engineering thermoplastics, composite matrix and ceramics. It offers high heat transfer, low shrinkage and low coefficient of thermal expansion. Applications: This adhesive is principally used to form thermally conductive joints in fabricated heat sinks and power devices. Fabricating heat sinks. Bonding semiconductors and transistors to heat sinks.