Description
TIM-PC 8850FT is a pourable filled epoxy resin system offering excellent heat transfer, high voltage insulation,
low exotherm and minimum shrinkage. This system shows uniform filler distribution in cured resin. It rapidly
transfers heat, eliminates hot spot, and increases the operating efficiency of most encapsulated devices. Its low
shrinkage minimizes risk of damage to fragile components.
Applications: It is useful for potting and encapsulating densely packaged power supplies and heat generating
components, integrated circuits, power and operational amplifiers, transformers and many types of
semiconductors.