Description
TIM-PC 8550TC is a two parts, thermally conductive, low viscosity thixotropic compounds which cures at room
temperature or can be accelerated with heat. Specially designed to achieve low hardness and primer-less
adhesion to substrates includes metals, plastics and ceramics. Excellent dielectric encapsulation and vibration
absorption.
Applications: Potting and encapsulating of Equipment modules, Power supplies, relays and amplifiers,
Transformers, coils and ferrite cores. Fiber optic wave guide coatings. Encapsulation of circuit boards